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Xiaomi reportedly to build second in-house flagship chip on TSMC 3nm, skip 2nmnode
Xiaomi will produce its second in-house flagship chip, Xring O2, using TSMC's 3nm technology, skipping the newer 2nm node due to costs and capacity issues. This chip follows the Xring O1 launched in early 2025, marking Xiaomi's expansion in processor development. The Xring O2 is expected to debut in flagship smartphones in mid-2025, ahead of competitors launching 2nm chips later in the year.
Key points
- Xiaomi's Xring O2 will be manufactured using TSMC's 3nm N3P process.
- The choice to avoid the 2nm technology is influenced by cost and production capacity.
- Xring O2 is set to be launched in the first half of 2025, aligning with flagship smartphone releases.
- Xring O1, the first self-developed processor by Xiaomi, was launched earlier in 2025 using the N3E process.
- By launching Xring O2 before competitors' 2nm chips, Xiaomi hopes to capitalize on first-mover advantages.
Why it matters
- The trend of chip development is influenced by industry shifts toward smaller process nodes, with 3nm being prominent in 2025.
- Xiaomi's in-house chip development follows a wider trend seen in the tech industry, as companies prioritize supply chain independence.
- The competitive advantage of reaching the market first is crucial as larger firms, like Apple and Qualcomm, prepare to release 2nm chips.
Xiaomi's strategy in chip development highlights its ambition to compete in the high-end mobile processor market while leveraging current manufacturing technologies to gain an early advantage over major competitors.