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Huawei’s mate 90 series expected to debut new Kirin chip this autumn
Huawei's Mate 90 series is set to debut a new Kirin smartphone chip this autumn, implementing innovative logic folding technology that enhances transistor density and energy efficiency, as announced by board member He Tingbo at ISCAS 2026. This chip aims to challenge Apple's iPhone 18 series upon its launch in September.
Key points
- Huawei will launch a new Kirin chip in autumn 2023.
- The chip incorporates logic folding technology for the first time.
- Logic folding technology improves transistor density and energy efficiency.
- Announcement made by He Tingbo at ISCAS 2026 in Shanghai.
- The Mate 90 smartphone series, housing the new chip, is expected to compete with Apple's iPhone 18.
Why it matters
- In 2025, the semiconductor market is focused on innovations in chip design, especially in energy efficiency.
- The introduction of dual-layer chip designs aligns with the industry trend toward more compact and powerful processing capabilities.
- Competition in the smartphone market is intensifying with advancements in chip technology from major players like Huawei and Apple.
Huawei's upcoming Kirin chip signifies a critical shift in smartphone technology, positioning the company to challenge major competitors like Apple in the increasingly dynamic market.