EXPLORINEER
en

CN — TechNode

AI inference chip startup Nano-core Chip raises over RMB 1 billion in Series C2 funding

Chips1 min read

Nano-core Chip, a Hangzhou-based startup that makes chips for running AI, raised more than RMB 1 billion in a new funding round. The money will help it finish products and prepare for mass production.

What happened

On October 28, Nano-core Chip announced that it had raised more than RMB 1 billion in Series C2 funding. JianTou Investment led the round. Hangzhou Capital, Kaitai Capital, and other investors also took part. The company plans to use the money for product development and for getting ready to make chips in large numbers.

Key numbers and facts

  • Funding amount: more than RMB 1 billion
  • Founded: 2021
  • Its first three chips have finished tape-out (the final design step before chips are made)
  • Customer sampling and first volume shipments are planned for early 2027
  • The previous round, Series C1, was RMB 1 billion and was announced in September

Background

Nano-core Chip was started in 2021 and grew up inside a research institute linked to Peking University in Zhejiang. Its chips mix three technologies. Near-memory computing and in-memory computing do work close to where data is stored, which can save time and energy. RISC-V is an open chip design method that anyone can use. The company sells to both devices and cloud computing centers.

Why it matters

AI chips that run trained AI models, often called inference chips, are in high demand. This large funding round shows that investors still believe in new chip designs in China. The company now has to turn its designs into products that customers can buy and use.

What to watch

  • Whether customer sampling starts on time
  • Whether the company reaches volume shipments in early 2027
  • How the new funding is used for product development and production

Glossary

Series C2 funding
A later round of money raised from investors to help a company grow.
Near-memory computing
A design that does calculations close to where data is stored, to save time and power.
RISC-V
An open, free-to-use design standard for building computer processors.

Same story, different eyes

Ad

Add 150 words. Learn 10 a day.

Dicter word books send only the words you learn to your review notes.

ChipsThe Register

PC chip plunge wipes out a quarter of Intel’s value

Intel's share price fell almost a quarter on Thursday after the company reported a steep drop in PC processor sales, despite Q3 revenue rising 21 percent year on year to $16.5 billion on strong datacenter and AI growth. CEO Lip Bu Tan predicted the PC chip market will shrink 12 percent next year and forecast a major CPU boom for datacenters, but executives admitted Intel may struggle to meet demand due to supply constraints such as silicon wafer sourcing.

ChipsZDNet Korea

[Profile] Ahn Hyun, President of SK hynix Americas

SK hynix announced on the 30th that Ahn Hyun, its Chief Development Officer (CDO) president, will be appointed head of the newly created Americas division, a president-level organization based in the United States, effective November 1. The company also released Ahn's career summary, which includes a 1967 birth year, a nuclear engineering degree from Seoul National University, and roles including NAND development planning group head and head of the Global AI Research Center.

ChipsThe Verge

Intel says it’s selling every affordable laptop chip it can make

During Intel's latest earnings call, CEO Lip-Bu Tan said demand for the budget-focused Wildcat Lake chips is outstripping supply, and CFO David Zinsner said the chips are now sold out. Intel does not expect the RAM shortage to improve in 2027, though Zinsner said the company is still bullish on the PC market, predicting a "renaissance" despite the challenges.

ChipsITmedia

Oracle Cloud to Adopt Google TPU, Starting Service in 2027

Oracle announced it will bring Google's AI-dedicated Tensor Processing Units (TPUs) into Oracle Cloud Infrastructure and begin offering Google TPU services in 2027. The plan was revealed at Oracle AI World 2026 in Las Vegas, where Oracle said it will provide the power, cooling, and in-data-center networking needed to deploy TPUs at scale.