Archive — US — techcrunch
Singapore’s Nexstrom wants to bring 2D semiconductors to chip fabs
Nexstrom, a Singapore-based startup, aims to revolutionize semiconductor production by developing 2D materials (TMDs) for chip fabs to address issues of electron flow, leakage, and heat in traditional silicon chips. The startup has raised $12 million to advance manufacturing processes aimed at large-scale production and is collaborating with major chipmakers while targeting commercial readiness by 2030-2035.
Key points
- Nexstrom is focusing on 2D materials (TMDs) to mitigate issues in traditional silicon semiconductors, addressing electron flow problems.
- The company has developed a product, North Star, designed to produce TMDs on 300mm wafers used in commercial chipmaking.
- Funding of $12 million aims to enhance technology and process control, expand teams, and further qualification with potential clients.
- Nexstrom is not competing with major chipmakers but intends to collaborate with them by supplying its technology.
- The company plans to solve scalability issues in producing high-quality TMDs across full-size wafers, targeting commercial production readiness by 2030-2035.
Why it matters
- The shift towards 2D materials in semiconductor manufacturing aligns with ongoing trends in miniaturization and efficiency in IT and electronics.
- The global chip shortage spurred by increased demand for data centers highlights the industry's need for innovative solutions.
- Companies like TSMC and Intel have also been exploring 2D materials for advanced chips, emphasizing a collective industry focus on next-gen semiconductor technology.
Nexstrom's innovative approach in developing 2D semiconductors could significantly impact the semiconductor industry, tackling longstanding issues while potentially leading to more efficient chip production by 2030-2035.